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Join date: Mar 10, 2024
Posts (432)
May 28, 2025 ∙ 3 min
IEDM2024|Hybrid Bonding Technology for 3D Chiplet AI Applications
Introduction Hybrid bonding technology is an innovative ultra-fine pitch interconnect method, suitable for high-performance chiplet...
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May 23, 2025 ∙ 4 min
OFC2025|Diagnosis of Aerial Telecom Facilities Using High-Precision Φ-OTDR DAS Technology
Introduction Maintenance and monitoring of telecommunications infrastructure are crucial to ensuring reliable service. Traditional...
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May 22, 2025 ∙ 3 min
IEDM2024|TSMC’s Next-Generation SoIC System-Level Chip Integration Platform
Introduction As semiconductor technology continues to evolve, the demand for high-performance computing (HPC) applications is rapidly...
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