AIM Photonics Announces New Opto-electronic Testing Services

Comprehensive toolset expands access to companies of all sizes to advanced testing capabilities for their prototype development

AIM Photonics recently announced the launch of its new Opto-electronic Testing Services, featuring a full suite of advanced tools for testing both photonic integrated circuits (PICs) as well as conventional electronic ICs.

The new service will be offered through AIM Photonics’ Test, Assembly and Packaging facility in Rochester, NY, the only place in the U.S. that provides access to both photonic and electronic test, assembly, and packaging prototyping services for substrates up to 300 mm wafers.

The large automated prober in AIM Photonics’ test lab enables programmable optical, DC and RF interrogation of wafer substrates as larges as 300 mm, with additional flexibility for die-level testing.

“Our comprehensive toolset can test and measure multiple performance aspects of electronic and photonic devices before and immediately after package assembly, allowing for rapid verification and optimization of the manufacturing process all in the same R&D center, saving our members and customers valuable time and resources,” said Chris Striemer, Business Development and Facilities Manager at AIM Photonics test, assembly and packaging facility.

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https://www.photonics.com/Articles/AIM_Photonics_to_Offer_Optoelectronic_Testing/a69050