top of page
IEDM2024|Hybrid Bonding Technology for 3D Chiplet AI Applications
Introduction Hybrid bonding technology is an innovative ultra-fine pitch interconnect method, suitable for high-performance chiplet...
Latitude Design Systems
May 28, 20253 min read
OFC2025|Diagnosis of Aerial Telecom Facilities Using High-Precision Φ-OTDR DAS Technology
Introduction Maintenance and monitoring of telecommunications infrastructure are crucial to ensuring reliable service. Traditional...
Latitude Design Systems
May 23, 20254 min read
IEDM2024|TSMC’s Next-Generation SoIC System-Level Chip Integration Platform
Introduction As semiconductor technology continues to evolve, the demand for high-performance computing (HPC) applications is rapidly...
Latitude Design Systems
May 22, 20253 min read
IEDM2024|Advanced Backside Power Delivery Network Technology for CPUs
Introduction In the sub-2nm semiconductor technology domain, power delivery network (PDN) design plays a crucial role in the performance...
Latitude Design Systems
May 21, 20253 min read
bottom of page