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之光半導體聚焦設計自動化:加速產業邁向光電共封裝(CPO)
隨著人工智慧(AI)模型規模呈指數級成長,高效能運算(HPC)系統的瓶頸已從「算力」轉向「傳輸」。之光半導體(Latitude Design Systems)創辦人暨技術長陳昇祐博士,日前應邀至國立清華大學電機工程學系發表專題演講,主題為「算力再強,卡在傳輸?矽光子:打通 AI 叢集任督二脈的光速鑰匙」,指出矽光子技術是因應 AI 算力增長,克服傳統電性互連極限的關鍵路徑。 矽光子:跨越摩爾定律後的關鍵技術 陳博士在演講中表示,當前 AI 模型規模快速成長,GPU 叢集的算力雖顯著提升,但系統瓶頸逐漸轉移到節點之間的資料傳輸。傳統電性互連在距離、頻寬與功耗上已接近極限,矽光子技術則提供了更高頻寬與更低功耗的替代方案。 他以實際系統架構為例,說明矽光子如何透過光電共封裝(Co-Packaged Optics, CPO)技術整合至晶片層級,將電氣路徑縮短並降低信號損耗,成為大型 AI 叢集實現高效能與低延遲的關鍵路徑。 從封裝到設計:AI 傳輸瓶頸的全系統觀點 陳博士進一步從異質整合封裝、光電模組設計到 EDA 工具支援等層面,深入分析了矽光子產業鏈

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The Challenges Of Working With Photonics – Meeting Note
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矽光子領域的創新策略:Latitude Design Systems技術長陳昇祐於清華大學演講
Latitude Design Systems 共同創辦人暨技術長陳昇祐近日應清華大學洪世章講座教授之邀,回到母校為學弟妹們分享「矽光子領域的創新策略」。此次演講介紹了Latitude Design Systems 在矽光子領域的領先技術與創新實力,為推動產學合作揭開了新篇...

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Minimizing power, energy, or thermal impacts requires a concerted approach throughout the entire design, development, and implementation...

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