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IEDM2024|TSMC’s Next-Generation SoIC System-Level Chip Integration Platform
Introduction As semiconductor technology continues to evolve, the demand for high-performance computing (HPC) applications is rapidly...

Latitude Design Systems
May 223 min read


Innovation and Development of Broadcom's 3.5D XDSiP Technology in Artificial Intelligence Computing
Introduction In the field of artificial intelligence (AI) computing, traditional process scaling is facing limitations, while the...

Latitude Design Systems
Mar 103 min read


Chiplet Design and Heterogeneous Integration Packaging
Introduction The semiconductor industry has identified five major growth engines (applications): mobile, high-performance computing...

Latitude Design Systems
Jun 12, 20244 min read
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