top of page

IEDM2024|CMOS-Integrated Subtractive Microfluidics as a Novel Lab-on-Chip Platform

Introduction

Subtractive microfluidics fabricates fluidic channels by selectively removing metal layers from CMOS chips, tightly integrating microfluidic technology with CMOS processes. This achieves analytical functionalities in a compact, chip-scale laboratory platform [1].

CMOS subtractive microfluidics
Figure 1: Conceptual illustration of CMOS subtractive microfluidics, showing the layered structure and comparison with traditional CMOS.
Technology Overview

Subtractive microfluidics utilizes the backend metal interconnect layers in CMOS chips as sacrificial materials. Through controlled wet etching, these metal layers are removed to form precisely defined fluidic channels. Compared to traditional methods, this technique offers multiple advantages, including perfect alignment between electronic components and fluidic channels, high integration, and scalability down to sub-micron dimensions.

Concept of distributed pad openings
Figure 2: Concept of distributed pad openings and schematic using PDMS sealing mechanism, demonstrating efficient metal etching strategy.
Fabrication Process

The process begins with standard CMOS chips containing predefined metal patterns, which serve as the blueprint for fluidic channels. To enhance etching efficiency, small pad openings are strategically placed along the channels. These openings provide additional access points for etchants, significantly improving the removal efficiency of metal layers. After etching, the openings are sealed using PDMS (polydimethylsiloxane) microfluidic structures.

functional microfluidic structures
Figure 3: Demonstration of functional microfluidic structures, including a micromixer with blue and yellow dye solutions, and a 1:64 splitter loaded with microbeads.
System Assembly and Integration

The system assembly process involves several key steps to ensure the proper functionality and protection of electronic components. First, the CMOS chip is embedded into a PCB using biocompatible epoxy resin, followed by wire bonding and encapsulation. During assembly, the PDMS layer protects the chip surface and additional PDMS structures are added for fluid transport.

illustration of the system assembly process
Figure 4: Step-by-step illustration of the system assembly process, showing chip embedding, wire bonding, and protection strategies.
Integrated Sensing Functions

The platform directly integrates multiple sensing modalities with microfluidic channels:

schematic of an integrated ISFET sensor
Figure 5: Detailed schematic of an integrated ISFET sensor, showing the sensing mechanism and equivalent circuit model.
Performance characterization of ISFETs
Figure 6: Performance characterization of ISFETs, showing pH response, drift behavior, and noise characteristics.

Ion-sensitive field-effect transistors (ISFETs) implemented using thick-oxide NMOS transistors enable pH sensing. The sensing region is defined by metal layer M5 and includes two different sizes (6µm × 12µm and 6µm × 24µm), exhibiting different sensitivities.

Hall sensor implemented using N-well resistors
Figure 7: Hall sensor implemented using N-well resistors, showing the process of metal removal down to lower layers.
Hall sensor’s magnetic field
Figure 8: Characterization of Hall sensor’s magnetic field response before and after etching.

Hall sensors based on N-well resistors enable magnetic field detection. These sensors remain functional after the etching process. While some offset voltage is introduced, it can be compensated through circuit techniques.

Impedance Sensing System
integrated impedance readout circuit
Figure 9: Architecture of the integrated impedance readout circuit using via electrodes for sensing.
schematic of the transimpedance amplifier
Figure 10: Detailed schematic of the transimpedance amplifier used in the impedance sensing system.

This platform includes a fully differential impedance sensing system with integrated readout circuits. The vias between metal layers M5 and M6 serve as fluid-interface electrodes, exposed during the channel formation process.

Photograph of the fabricated chip
Figure 11: Photograph of the fabricated chip, showing the etched fluidic structures with via electrodes and measurement setup.
Demonstration of impedance sensing capabilities
Figure 12: Demonstration of impedance sensing capabilities using solutions with varying ionic strength.
Performance and Applications

The subtractive microfluidics platform successfully realizes various microfluidic structures, including micromixers and 1:64 splitters. The integrated sensors exhibit reliable performance: ISFETs demonstrate pH sensitivity, and Hall sensors maintain stable magnetic field detection capabilities. The impedance sensing system effectively measures different ionic concentrations and can be applied in cell detection and analysis.

This innovative microfluidic integration method within CMOS technology is suitable for highly integrated, high-throughput lab-on-chip applications. The platform combines complex electronic functionalities with precise fluid handling capabilities, offering significant advantages for point-of-care diagnostics and bioanalytical applications.

Reference

[1] W.-Y. Weng, A. Di, X. Zhang, Y.-C. Tsai, Y.-T. Hsiao, and J.-C. Chien, "Subtractive Microfluidics in CMOS," in 2024 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2024.

Comments


bottom of page