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之光半導體聚焦設計自動化：加速產業邁向光電共封裝（CPO）
隨著人工智慧（AI）模型規模呈指數級成長，高效能運算（HPC）系統的瓶頸已從「算力」轉向「傳輸」。之光半導體（Latitude Design Systems）創辦人暨技術長陳昇祐博士，日前應邀至國立清華大學電機工程學系發表專題演講，主題為「算力再強，卡在傳輸？矽光子：打通 AI 叢集任督二脈的光速鑰匙」，指出矽光子技術是因應 AI 算力增長，克服傳統電性互連極限的關鍵路徑。 矽光子：跨越摩爾定律後的關鍵技術 陳博士在演講中表示，當前 AI 模型規模快速成長，GPU 叢集的算力雖顯著提升，但系統瓶頸逐漸轉移到節點之間的資料傳輸。傳統電性互連在距離、頻寬與功耗上已接近極限，矽光子技術則提供了更高頻寬與更低功耗的替代方案。 他以實際系統架構為例，說明矽光子如何透過光電共封裝（Co-Packaged Optics, CPO）技術整合至晶片層級，將電氣路徑縮短並降低信號損耗，成為大型 AI 叢集實現高效能與低延遲的關鍵路徑。 從封裝到設計：AI 傳輸瓶頸的全系統觀點 陳博士進一步從異質整合封裝、光電模組設計到 EDA 工具支援等層面，深入分析了矽光子產業鏈
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