之光半導體共同創辦人暨技術長陳昇祐博士，於群益證券科技講座中深度解析矽光子技術與CPO在AI時代的關鍵角色。之光半導體／提供 AI模型正以前所未有的速度擴張，驅動資料中心架構走向AI工廠，光學互連的技術路線走向關鍵的十字路口。於一場由群益證券科技為特定貴賓舉辦的閉門講座中，...

Introduction Hybrid bonding technology is an innovative ultra-fine pitch interconnect method, suitable for high-performance chiplet...

Introduction The semiconductor industry continues to drive device scaling and integration density through innovative transistor...

Introduction With the rapid development of artificial intelligence (AI) and high-performance computing (HPC) technologies, the demands on...